Inventor · disambiguated record
Jiunn Chen
Also filed as: CHEN JIUNN · CHEN JIUNN-JIA
3 granted patents·1 pending application·10 citations·filing 2006–2010
60Inventor score
Top patents by PatentIndex Score
4 records- 0172US7518241B2Wafer structure with a multi-layer barrier in an UBM layer network device with power supplyADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Apr 14, 2009·7 cites·14 claims
- 0267US7696060B2Recyclable stamp device and recyclable stamp process for wafer bondADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Apr 13, 2010·3 cites·20 claims
- 0338US8222726B2Semiconductor device package having a jumper chip and method of fabricating the sameCHANG HSIAO-CHUAN·Filed 2010·Granted Jul 17, 2012·0 cites·16 claims
- 0429US2012035911A1Customer premises equipment and configuration method thereofCHEN JIUNN-JIA·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →