Inventor · disambiguated record
James K. Lake
Also filed as: LAKE JAMES · LAKE JAMES K · LAKE JAMES KENNETH
10 granted patents·314 citations·filing 1993–2013
92Inventor score
Top patents by PatentIndex Score
10 records- 0189US5328660ALead-free, high temperature, tin based multi-component solderIBM·Filed 1993·Granted Jul 12, 1994·56 cites·1 claims
- 0282US5368814ALead free, tin-bismuth solder alloysIBM·Filed 1993·Granted Nov 29, 1994·69 cites·2 claims
- 0378US7576434B2Wafer-level solder bumpsINTEL CORP·Filed 2007·Granted Aug 18, 2009·11 cites·14 claims
- 0477US5393489AHigh temperature, lead-free, tin based solder compositionIBM·Filed 1993·Granted Feb 28, 1995·56 cites·1 claims
- 0574US5344607ALead-free, high tin, ternary solder alloy of tin, bismuth, and indiumIBM·Filed 1993·Granted Sep 6, 1994·25 cites·1 claims
- 0670US5411703ALead-free, tin, antimony, bismtuh, copper solder alloyIBM·Filed 1993·Granted May 2, 1995·41 cites·1 claims
- 0766US5414303ALead-free, high tin, ternary solder alloy of tin, bismuth, and indiumIBM·Filed 1994·Granted May 9, 1995·19 cites·4 claims
- 0858US6019270ASoldering iron tipLOCKHEED CORP·Filed 1996·Granted Feb 1, 2000·22 cites·11 claims
- 0948US9622356B2Electronic package mountingLOCKHEED CORP·Filed 2013·Granted Apr 11, 2017·1 cites·5 claims
- 1045US6145735AThin film solder paste deposition method and toolsLOCKHEED CORP·Filed 1998·Granted Nov 14, 2000·14 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →