Inventor · disambiguated record
Hyung Suk Yang
Also filed as: YANG HYUNG-SUK
1 granted patent·1 pending application·64 citations·filing 2012–2016
50Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0194US8742576B2Maintaining alignment in a multi-chip module using a compressible structureTHACKER HIREN D·Filed 2012·Granted Jun 3, 2014·64 cites·20 claims
- 0230US2018294211A1Vertically curved mechanically flexible interconnects, methods of making the same, and methods of useGEORGIA TECH RES INST·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →