Inventor · disambiguated record

Hyung-Iae Eun

Also filed as: EUN HYUNG-IAE

2 granted patents·57 citations·filing 2007–2013

62Inventor score

Technology areasH10W

Files withEUN HYUNG-IAE2

Top patents by PatentIndex Score

2 records

0188US8395259B2Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the sameEUN HYUNG-IAE·Filed 2007·Granted Mar 12, 2013·55 cites·17 claims
0263US9397034B2Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the sameEUN HYUNG-IAE·Filed 2013·Granted Jul 19, 2016·2 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →