Inventor · disambiguated record

Hyee Ryang Do

Also filed as: DO HYEE RYANG

0 granted patents·1 pending application·0 citations·filing 2016–2016

Technology areasA43B

Files withDO JAE EUN1

Top patents by PatentIndex Score

1 record

0117US2017202306A1Article of footwear with new insole board and insole structure to absorb shock and keep resilience at forefoot and heel areas of footDO JAE EUN·Filed 2016·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →