Inventor · disambiguated record
Hung-Chou Yang
Also filed as: YANG HUNG-CHOU
2 granted patents·2 pending applications·0 citations·filing 2008–2011
27Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0144US8053904B2Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making sameHARVATEK CORP·Filed 2009·Granted Nov 8, 2011·0 cites·6 claims
- 0238US2011018018A1Semiconductor chip package structure for achieving electrical connection without using wire-bonding process and method for making the sameHARVATEK CORP·Filed 2009·Application pending·0 cites
- 0337US8748209B2Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making the sameWANG BILY·Filed 2011·Granted Jun 10, 2014·0 cites·11 claims
- 0436US2009206465A1Semiconductor chip package structure for achieving electrical connection without using a wire-bonding process and method for making the sameHARVATEK CORP·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →