Inventor · disambiguated record

Hou Nion Chan

Also filed as: CHAN HOU NION

2 granted patents·3 citations·filing 2018–2019

43Inventor score

Technology areasH10P

Files withSEMICONDUCTOR COMPONENTS IND LLC2

Top patents by PatentIndex Score

2 records

0180US10373869B2Method of separating a back layer on a substrate using exposure to reduced temperature and related apparatusSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Aug 6, 2019·3 cites·20 claims
0254US10854516B2Method of separating a back layer on a substrate using exposure to reduced temperature and related apparatusSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Dec 1, 2020·0 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →