Inventor · disambiguated record
Hiroshi Okoshi
Also filed as: OKOSHI HIROSHI
2 granted patents·2 citations·filing 2011–2015
39Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0170US9496468B2Curable resin composition, curable resin composition tablet, molded body, semiconductor package, semiconductor component and light emitting diodeKANEKA CORP·Filed 2015·Granted Nov 15, 2016·2 cites·25 claims
- 0241US9178120B2Curable resin composition, curable resin composition tablet, molded body, semiconductor package, semiconductor component and light emitting diodeKOKUBO TADASHI·Filed 2011·Granted Nov 3, 2015·0 cites·30 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →