Inventor · disambiguated record
Hirokazu Nanjo
Also filed as: NANJO HIROKAZU
2 granted patents·7 citations·filing 2014–2014
52Inventor score
Technology areasH10W
Files withFUJIKURA LTD2
Top patents by PatentIndex Score
2 records- 0167US9351410B2Electronic component built-in multi-layer wiring board and method of manufacturing the sameFUJIKURA LTD·Filed 2014·Granted May 24, 2016·4 cites·4 claims
- 0263US9253882B2Electronic component built-in multi-layer wiring board and method of manufacturing the sameFUJIKURA LTD·Filed 2014·Granted Feb 2, 2016·3 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →