Inventor · disambiguated record
Heung Ku Kim
Also filed as: KIM HEUNG KU
2 granted patents·1 pending application·0 citations·filing 2011–2014
23Inventor score
Files withSAMSUNG ELECTRO MECH3
Top patents by PatentIndex Score
3 records- 0134US2015096797A1Package board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 0231US9466553B2Package structure and method for manufacturing package structureSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 11, 2016·0 cites·4 claims
- 0327US8379406B2Package and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2011·Granted Feb 19, 2013·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →