Inventor · disambiguated record

Hengtien Henry Chen

Also filed as: CHEN HENGTIEN H · CHEN HENGTIEN HENRY

2 granted patents·85 citations·filing 1995–1997

66Inventor score

Technology areasH10P

Files withWINBOND ELECTRONICS CORP2

Top patents by PatentIndex Score

2 records

0176US5976949AMethod for forming shallow trench isolationWINBOND ELECTRONICS CORP·Filed 1997·Granted Nov 2, 1999·71 cites·16 claims
0241US5518949AElectrical isolation method for devices made on SOI waferWINBOND ELECTRONICS CORP·Filed 1995·Granted May 21, 1996·14 cites·13 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →