Inventor · disambiguated record

Hansae Lim

Also filed as: LIM HANSAE

0 granted patents·5 pending applications·0 citations·filing 2024–2025

Technology areasH10W

Files withSAMSUNG ELECTRONICS CO LTD5

Top patents by PatentIndex Score

5 records

0164US2025105152A1Semiconductor package and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
0263US2025062167A1Semiconductor packages including dam structuresSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
0362US2025125245A1Semiconductor package and wiring substrate used for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
0462US2025046768A1Semiconductor chips and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
0553US2025357229A1Semiconductor packages including spacersSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →