Inventor · disambiguated record
Ha-Dih Hsieh
Also filed as: HSIEH HA-DIH
0 granted patents·3 pending applications·0 citations·filing 2001–2013
Files withLIEN DING SYSTEMS CO LTD1
Top patents by PatentIndex Score
3 records- 0117US2014260884A1Substrate processing methodLIEN DING SYSTEMS CO LTD·Filed 2013·Application pending·0 cites
- 029US2002182021A1Cutting tool material rod for machining of printed circuit board and method of fabricating the sameFiled 2001·Application pending·0 cites
- 037US2002193053A1Recycling process for cutting tools for machining printed circuit boardsFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →