Inventor · disambiguated record
Genzo Watanabe
Also filed as: WATANABE GENZO
1 granted patent·1 pending application·0 citations·filing 2012–2014
2Inventor score
Top patents by PatentIndex Score
2 records- 0130US9686871B2Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering methodTANIGUROGUMI CORP·Filed 2014·Granted Jun 20, 2017·0 cites·5 claims
- 0226US2014036427A1Component having an electrode corrosion preventing layer and a method for manufacturing the componentTANIGURO KATSUMORI·Filed 2012·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Genzo Watanabe files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →