Inventor · disambiguated record
Gary R. Waldsmith
Also filed as: WALDSMITH GARY R
4 granted patents·43 citations·filing 1991–1994
76Inventor score
Top patents by PatentIndex Score
4 records- 0146US5448817ACryogenic removal of silicon substrates from metallic heat sinks using thermal mass to cool surface mounted printed wire boardsUS ARMY·Filed 1994·Granted Sep 12, 1995·19 cites·11 claims
- 0240US5199159AMethods for cryogenic removal of epoxy/wire field windings and for separating multi-layer printed circuit wiring boardsUS AIR FORCE·Filed 1991·Granted Apr 6, 1993·10 cites·6 claims
- 0337US5070603AMethod of separating multi-layer printed circuit wiring boardsUS AIR FORCE·Filed 1991·Granted Dec 10, 1991·9 cites·10 claims
- 0431US5297327ACryogenic removal method for epoxy impregnated coils from rigid outer housingsUS ARMY·Filed 1993·Granted Mar 29, 1994·5 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →