Inventor · disambiguated record
Fankun Wu
Also filed as: WU FANKUN
1 granted patent·4 pending applications·0 citations·filing 2023–2024
8Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0155US2025174512A1Power Module, Manufacturing Method, and Electronic DeviceHUAWEI DIGITAL POWER TECH CO LTD·Filed 2024·Application pending·0 cites
- 0253US12482716B2Power module, preparation mold, and deviceHUAWEI TECH CO LTD·Filed 2023·Granted Nov 25, 2025·0 cites·13 claims
- 0353US2025210492A1Power module, production method thereof, and power deviceHUAWEI DIGITAL POWER TECH CO LTD·Filed 2024·Application pending·0 cites
- 0447US2023219269A1Injection mold and injection molding methodHUAWEI TECH CO LTD·Filed 2023·Application pending·0 cites
- 0546US2023238315A1Semiconductor packaged structure and manufacturing method thereof, and semiconductor deviceHUAWEI TECH CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →