Inventor · disambiguated record
Eugene O. Hempel, Jr.
Also filed as: HEMPEL EUGENE O · HEMPEL JR EUGENE O
7 granted patents·419 citations·filing 1994–1997
90Inventor score
Files withTEXAS INSTRUMENTS INC7
Top patents by PatentIndex Score
7 records- 0190US5893753AVibrating polishing pad conditioning system and methodTEXAS INSTRUMENTS INC·Filed 1997·Granted Apr 13, 1999·62 cites·20 claims
- 0289US5597346AMethod and apparatus for holding a semiconductor wafer during a chemical mechanical polish (CMP) processTEXAS INSTRUMENTS INC·Filed 1995·Granted Jan 28, 1997·94 cites·18 claims
- 0387US5851138APolishing pad conditioning system and methodTEXAS INSTRUMENTS INC·Filed 1997·Granted Dec 22, 1998·80 cites·17 claims
- 0484US5609719AMethod for performing chemical mechanical polish (CMP) of a waferTEXAS INSTRUMENTS INC·Filed 1994·Granted Mar 11, 1997·50 cites·9 claims
- 0582US5683289ACMP polishing pad conditioning apparatusTEXAS INSTRUMENTS INC·Filed 1996·Granted Nov 4, 1997·62 cites·20 claims
- 0673US5895270AChemical mechanical polishing method and apparatusTEXAS INSTRUMENTS INC·Filed 1996·Granted Apr 20, 1999·37 cites·6 claims
- 0762US5597443AMethod and system for chemical mechanical polishing of semiconductor waferTEXAS INSTRUMENTS INC·Filed 1994·Granted Jan 28, 1997·34 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →