Inventor · disambiguated record
Eisuke Kodama
Also filed as: KODAMA EISUKE
6 granted patents·2 pending applications·3 citations·filing 2002–2023
67Inventor score
Top patents by PatentIndex Score
8 records- 0155US2024030131A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 0252US9917054B2Semiconductor device including a fuse formed on a high thermal conductivity insulating filmRENESAS ELECTRONICS CORP·Filed 2014·Granted Mar 13, 2018·0 cites·10 claims
- 0346US6607989B2Method for forming an interconnect pattern in a semiconductor deviceNEC ELECTRONICS CORP·Filed 2002·Granted Aug 19, 2003·3 cites·10 claims
- 0445US2018138122A1Semiconductor device and manufacturing method of the sameRENESAS ELECTRONICS CORP·Filed 2017·Application pending·0 cites
- 0544US11177395B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2020·Granted Nov 16, 2021·0 cites·9 claims
- 0643US10818747B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2019·Granted Oct 27, 2020·0 cites·15 claims
- 0739US10224319B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Mar 5, 2019·0 cites·12 claims
- 0833US10229903B2Semiconductor device with a resistance element and an electrostatic protection elementRENESAS ELECTRONICS CORP·Filed 2017·Granted Mar 12, 2019·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →