Inventor · disambiguated record
Dorothy A. Heim
Also filed as: HEIM DOROTHY A
6 granted patents·340 citations·filing 1992–1995
88Inventor score
Technology areasH10W
Files withLSI LOGIC CORP6
Top patents by PatentIndex Score
6 records- 0191US5248903AComposite bond pads for semiconductor devicesLSI LOGIC CORP·Filed 1992·Granted Sep 28, 1993·135 cites·29 claims
- 0281US5635424AHigh-density bond pad layout arrangements for semiconductor dies, and connecting to the bond padsLSI LOGIC CORP·Filed 1995·Granted Jun 3, 1997·48 cites·7 claims
- 0378US5284797ASemiconductor bond padsLSI LOGIC CORP·Filed 1992·Granted Feb 8, 1994·55 cites·18 claims
- 0476US5441917AMethod of laying out bond pads on a semiconductor dieLSI LOGIC CORP·Filed 1994·Granted Aug 15, 1995·39 cites·1 claims
- 0573US5565385ASemiconductor bond pad structure and increased bond pad count per dieLSI LOGIC CORP·Filed 1995·Granted Oct 15, 1996·33 cites·15 claims
- 0669US5404047ASemiconductor die having a high density array of composite bond padsLSI LOGIC CORP·Filed 1992·Granted Apr 4, 1995·30 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →