Inventor · disambiguated record

Derrick T. Hyde

Also filed as: HYDE DERRICK T

1 granted patent·7 citations·filing 2013–2013

28Inventor score

Technology areasC08J

Files withICP ADHESIVES AND SEALANTS INC1

Top patents by PatentIndex Score

1 record

0183US9593222B2Method and composition for filling elongated channels with expanding foam insulationICP ADHESIVES AND SEALANTS INC·Filed 2013·Granted Mar 14, 2017·7 cites·18 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →