Inventor · disambiguated record

Dae-Sup Hyun

Also filed as: HYUN DAE-SUP

1 granted patent·0 citations·filing 2018–2018

8Inventor score

Technology areasC08K

Files withDOW SILICONES CORP1

Top patents by PatentIndex Score

1 record

0142US11512236B2Silicone composition for temporary bonding adhesive, electronic article comprising cured body of the same, and manufacturing method thereofDOW SILICONES CORP·Filed 2018·Granted Nov 29, 2022·0 cites·12 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →