Inventor · disambiguated record
Curt A Erickson
Also filed as: ERICKSON CURT A
3 granted patents·172 citations·filing 1997–1998
77Inventor score
Files withDELCO ELECTRONICS CORP3
Top patents by PatentIndex Score
3 records- 0190US6180265B1Flip chip solder bump padDELCO ELECTRONICS CORP·Filed 1998·Granted Jan 30, 2001·83 cites·4 claims
- 0288US5891756AProcess for converting a wire bond pad to a flip chip solder bump pad and pad formed therebyDELCO ELECTRONICS CORP·Filed 1997·Granted Apr 6, 1999·72 cites·16 claims
- 0346US6184581B1Solder bump input/output pad for a surface mount circuit deviceDELCO ELECTRONICS CORP·Filed 1997·Granted Feb 6, 2001·17 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →