Inventor · disambiguated record
Come De Buttet
Also filed as: DE BUTTET COME
0 granted patents·2 pending applications·0 citations·filing 2023–2025
Top patents by PatentIndex Score
2 records- 0158US2025357130A1Manufacturing process comprising an assembly of semiconductor wafers and corresponding semiconductor deviceST MICROELECTRONICS INT NV·Filed 2025·Application pending·0 cites
- 0245US2024170451A1Assembly of integrated circuit wafersST MICROELECTRONICS CROLLES 2 SAS·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →