Inventor · disambiguated record

Cheng-Jun Yang

Also filed as: Yang cheng-jun

1 granted patent·0 citations·filing 2020–2020

6Inventor score

Technology areasH01B

Files withTPK ADVANCED SOLUTIONS INC1

Top patents by PatentIndex Score

1 record

0151US11538752B2Contact area structure with organic adhesive layer between inorganic conductive layer and transparent conductive layerTPK ADVANCED SOLUTIONS INC·Filed 2020·Granted Dec 27, 2022·0 cites·15 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →