Inventor · disambiguated record
Ching-Hsu Yang
Also filed as: YANG CHING-HSU
3 granted patents·3 pending applications·33 citations·filing 2003–2005
69Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0178US7446409B2Cavity-down multiple-chip packageADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Nov 4, 2008·13 cites·5 claims
- 0266US7224057B2Thermal enhance package with universal heat spreaderADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted May 29, 2007·18 cites·20 claims
- 0344US6972489B2Flip chip package with thermometerADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Dec 6, 2005·2 cites·22 claims
- 0435US2006091528A1High heat dissipation flip chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 0534US2005087864A1Cavity-down semiconductor package with heat spreaderADVANCED SEMICONDUCTOR ENG·Filed 2004·Application pending·0 cites
- 0633US2006091531A1Cavity-down thermally enhanced packageYANG CHING-HSU·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →