Inventor · disambiguated record
Cherng-Chiao Wu
Also filed as: WU CHERNG-CHIAO
1 granted patent·2 pending applications·0 citations·filing 2003–2019
10Inventor score
Technology areasH10W
Files withTAIWAN ELECTRONIC PACKAGING CO LTD2
Top patents by PatentIndex Score
3 records- 0126US10811399B1Optical sensing chip packaging structureTAIWAN ELECTRONIC PACKAGING CO LTD·Filed 2019·Granted Oct 20, 2020·0 cites·20 claims
- 0218US2020381574A1Optical sensing chip packaging structureTAIWAN ELECTRONIC PACKAGING CO LTD·Filed 2019·Application pending·0 cites
- 0311US2005017337A1Stacking apparatus for integrated circuit assemblyFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →