Inventor · disambiguated record

Chen-Pei Hsieh

Also filed as: HSIEH CHEN-PEI

1 granted patent·3 citations·filing 2019–2019

20Inventor score

Technology areasH10W

Files withPOWERTECH TECHNOLOGY INC1

Top patents by PatentIndex Score

1 record

0164US11158608B2Semiconductor package including offset stack of semiconductor dies between first and second redistribution structures, and manufacturing method thereforPOWERTECH TECHNOLOGY INC·Filed 2019·Granted Oct 26, 2021·3 cites·17 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →