Inventor · disambiguated record
Chika Arayama
Also filed as: ARAYAMA CHIKA
1 granted patent·1 pending application·0 citations·filing 2019–2020
3Inventor score
Technology areasH10W
Files withPANASONIC IP MAN CO LTD2
Top patents by PatentIndex Score
2 records- 0127US12033907B2Semiconductor encapsulation material and semiconductor devicePANASONIC IP MAN CO LTD·Filed 2020·Granted Jul 9, 2024·0 cites·6 claims
- 0222US2021309828A1Semiconductor-encapsulating resin composition, semiconductor device, and method for fabricating the semiconductor devicePANASONIC IP MAN CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →