Inventor · disambiguated record
Byong Ii Heo
Also filed as: HEO BYONG I · HEO BYONG II
2 granted patents·1 pending application·46 citations·filing 2004–2007
64Inventor score
Technology areasH10W
Files withAMKOR TECHNOLOGY INC3
Top patents by PatentIndex Score
3 records- 0183US7982297B1Stackable semiconductor package having partially exposed semiconductor die and method of fabricating the sameAMKOR TECHNOLOGY INC·Filed 2007·Granted Jul 19, 2011·23 cites·18 claims
- 0269US7009296B1Semiconductor package with substrate coupled to a peripheral side surface of a semiconductor dieAMKOR TECHNOLOGY INC·Filed 2004·Granted Mar 7, 2006·23 cites·20 claims
- 0335US2007272827A1Image sensor package having mount holder attached to image sensor dieAMKOR TECHNOLOGY INC·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →