Inventor · disambiguated record
Brian Deram
Also filed as: DERAM BRIAN · DERAM BRIAN T
2 granted patents·4 pending applications·15 citations·filing 2002–2010
57Inventor score
Top patents by PatentIndex Score
6 records- 0158US6786391B2Method of controlling solder deposition utilizing two fluxes and preformKAC HOLDINGS INC·Filed 2002·Granted Sep 7, 2004·12 cites·60 claims
- 0252US7653511B2Thermoconductimetric analyzer for soldering process improvementKESTER INC·Filed 2006·Granted Jan 26, 2010·3 cites·31 claims
- 0336US2007172381A1Lead-free solder with low copper dissolutionDERAM BRIAN T·Filed 2006·Application pending·0 cites
- 0427US2005023328A1Method of controlling solder deposition utilizing two fluxes and preformFiled 2004·Application pending·0 cites
- 0526US2007051774A1Method of controlling solder deposition on heat spreader used for semiconductor packageSTIPP JOHN N·Filed 2005·Application pending·0 cites
- 0623US2011096507A1Microelectronic thermal interfaceKESTER INC·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →