Inventor · disambiguated record

Bo Wi

Also filed as: WI BO R · WI BO RYEONG

1 granted patent·1 pending application·4 citations·filing 1999–2004

24Inventor score

Technology areasH10P H10W

Files withHYNIX SEMICONDUCTOR INC1 HYUNDAI ELECTRONICS IND1

Top patents by PatentIndex Score

2 records

0128US2006003541A1Method for forming device isolation film of semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2004·Application pending·0 cites
0227US6211047B1Method for forming contact of semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1999·Granted Apr 3, 2001·4 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →