Inventor · disambiguated record

Boon Siew Ng

Also filed as: NG BOON SIEW

1 granted patent·0 citations·filing 2022–2022

2Inventor score

Technology areasH10W

Files withINARI TECH SDN BHD1

Top patents by PatentIndex Score

1 record

0128US12418976B2System, process and a jig for forming conformal EMI shield on package-level electronics or a portion thereofINARI TECH SDN BHD·Filed 2022·Granted Sep 16, 2025·0 cites·9 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →