Inventor · disambiguated record
Benedict G. Pace
Also filed as: PACE BENEDICT G
12 granted patents·1 pending application·779 citations·filing 1993–2004
94Inventor score
Top patents by PatentIndex Score
13 records- 0195US6388264B1Optocoupler package being hermetically sealedFiled 2000·Granted May 14, 2002·147 cites·44 claims
- 0294US5627406AInverted chip bonded module with high packaging efficiencyFiled 1996·Granted May 6, 1997·178 cites·26 claims
- 0393US5904499APackage for power semiconductor chipsFiled 1997·Granted May 18, 1999·154 cites·30 claims
- 0488US6614110B1Module with bumps for connection and supportFiled 2000·Granted Sep 2, 2003·47 cites·16 claims
- 0585US5378313AHybrid circuits and a method of manufactureFiled 1993·Granted Jan 3, 1995·91 cites·20 claims
- 0679US6165820APackage for electronic devicesFiled 1999·Granted Dec 26, 2000·51 cites·36 claims
- 0778US5793105AInverted chip bonded with high packaging efficiencyFiled 1997·Granted Aug 11, 1998·46 cites·19 claims
- 0875US6613605B2Interconnection method entailing protuberances formed by melting metal over contact areasFiled 2000·Granted Sep 2, 2003·20 cites·48 claims
- 0968US7271028B1High density electronic interconnectionPACE BENEDICT G·Filed 2004·Granted Sep 18, 2007·14 cites·20 claims
- 1063US5866441AInverted chip bonded module with high packaging efficiencyFiled 1996·Granted Feb 2, 1999·24 cites·20 claims
- 1147US7421353B1Digital integration methodNAT HYBRID INC·Filed 2003·Granted Sep 2, 2008·5 cites·21 claims
- 1245US7132356B1Interconnection methodPACE BENEDICT G·Filed 2003·Granted Nov 7, 2006·2 cites·18 claims
- 1337US2002076910A1High density electronic interconnectionFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →