Inventor · disambiguated record
Bassam Abdel-Dayem
Also filed as: ABDEL-DAYEM BASSAM · ABDEL-DAYEM BASSAM A
5 granted patents·14 citations·filing 2003–2022
71Inventor score
Top patents by PatentIndex Score
5 records- 0191US12132028B2Semiconductor package with capacitance dieAMAZON TECH INC·Filed 2022·Granted Oct 29, 2024·2 cites·20 claims
- 0284US12066964B1Highly available modular hardware acceleration deviceAMAZON TECH INC·Filed 2021·Granted Aug 20, 2024·4 cites·20 claims
- 0352US12033960B1Semiconductor package with stiffener ring having elevated openingAMAZON TECH INC·Filed 2021·Granted Jul 9, 2024·0 cites·18 claims
- 0451US11923347B1Semiconductor package with multiple interposers on a single substrateAMAZON TECH INC·Filed 2021·Granted Mar 5, 2024·0 cites·20 claims
- 0546US7020968B1Fruit and vegetable coring machineABDEL-DAYEM BASSAM A·Filed 2003·Granted Apr 4, 2006·8 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →