Inventor · disambiguated record

Akira Ihisa

Also filed as: IHISA AKIRA

1 granted patent·39 citations·filing 1997–1997

48Inventor score

Technology areasH10W

Files withMITSUBISHI ELECTRIC CORP1

Top patents by PatentIndex Score

1 record

0169US6130481ASemiconductor integrated circuit interconnection structures and method of making the interconnection structuresMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Oct 10, 2000·39 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →