Inventor · disambiguated record
Ichiro Hazeyama
Also filed as: HAZEYAMA ICHIRO
14 granted patents·3 pending applications·230 citations·filing 1995–2022
92Inventor score
Top patents by PatentIndex Score
17 records- 0194US6998704B2Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatusNEC CORP·Filed 2003·Granted Feb 14, 2006·86 cites·56 claims
- 0275US7230328B2Semiconductor package and laminated semiconductor packageNEC CORP·Filed 2003·Granted Jun 12, 2007·22 cites·9 claims
- 0375US5714112AProcess for producing a silica sintered product for a multi-layer wiring substrateNEC CORP·Filed 1995·Granted Feb 3, 1998·43 cites·4 claims
- 0472US6926188B2Transfer apparatus for arraying small conductive bumps on a substrate and/ or chipJAPAN E M CO LTD·Filed 2003·Granted Aug 9, 2005·15 cites·9 claims
- 0569US6674016B2Electronic componentNITTO DENKO CORP·Filed 2002·Granted Jan 6, 2004·15 cites·11 claims
- 0667US6889886B2Transfer apparatus for arraying small conductive bumps on substrate and/ or chipJAPAN E M CO LTD·Filed 2002·Granted May 10, 2005·12 cites·30 claims
- 0760US2025084207A1Flame retardant thermoplastic resin composition, shaped product, and stretched filmZEON CORP·Filed 2022·Application pending·0 cites
- 0855US2021246284A1Shaped article and method of manufacturing the same, prepreg, and laminateZEON CORP·Filed 2019·Application pending·0 cites
- 0953US7352069B2Electronic component unitNITTO DENKO CORP·Filed 2003·Granted Apr 1, 2008·5 cites·11 claims
- 1052US2008266474A1Liquid crystal panel and liquid crystal display using the sameNEC LCD TECHNOLOGIES LTD·Filed 2008·Application pending·0 cites
- 1150US6348424B1Low-temperature calcined glass ceramic and a manufacturing process thereforNEC CORP·Filed 1999·Granted Feb 19, 2002·13 cites·35 claims
- 1249US7594644B2Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatusNEC CORP·Filed 2005·Granted Sep 29, 2009·0 cites·19 claims
- 1348US5902758ALow temperature firing glass-ceramic substrate and production process thereofNEC CORP·Filed 1998·Granted May 11, 1999·12 cites·7 claims
- 1444US10896827B2Support for manufacturing semiconductor packages, use of support for manufacturing semiconductor packages, and method for manufacturing semiconductor packagesZEON CORP·Filed 2017·Granted Jan 19, 2021·0 cites·6 claims
- 1542US9195327B2Touch panel and display device employing the sameNLT TECHNOLOGIES LTD·Filed 2012·Granted Nov 24, 2015·0 cites·7 claims
- 1641US7119438B2Method of arranging microspheres with liquid, microsphere arranging device, and semiconductor deviceJAPAN E M CO LTD·Filed 2003·Granted Oct 10, 2006·3 cites·12 claims
- 1734US5728470AMulti-layer wiring substrate, and process for producing the sameNEC CORP·Filed 1995·Granted Mar 17, 1998·4 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →