Inventor · disambiguated record
Roger Emigh
Also filed as: EMIGH ROGER · EMIGH ROGER A · EMIGH ROGER ALAN
11 granted patents·492 citations·filing 1994–2011
93Inventor score
Files withJOHNSON MATTHEY ELECT INC4HONEYWELL INT INC3STATS CHIPPAC LTD2CHOW SENG GUAN1ST ASSEMBLY TEST SERVICES LTD1
Top patents by PatentIndex Score
11 records- 0197US5590389ASputtering target with ultra-fine, oriented grains and method of making sameJOHNSON MATTHEY ELECT INC·Filed 1994·Granted Dec 31, 1996·88 cites·18 claims
- 0295US5809393ASputtering target with ultra-fine, oriented grains and method of making sameJOHNSON MATTHEY ELECT INC·Filed 1995·Granted Sep 15, 1998·71 cites·17 claims
- 0393US6775140B2Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devicesST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Aug 10, 2004·79 cites·24 claims
- 0490US5780755ASputtering target with ultra-fine, oriented grains and method of making sameJOHNSON MATTHEY ELECT INC·Filed 1995·Granted Jul 14, 1998·41 cites·8 claims
- 0587US5687600AMetal sputtering target assemblyJOHNSON MATTHEY ELECT INC·Filed 1996·Granted Nov 18, 1997·79 cites·16 claims
- 0685US6740972B2Electronic device having fibrous interfaceHONEYWELL INT INC·Filed 2001·Granted May 25, 2004·39 cites·13 claims
- 0783US6713151B1Compliant fibrous thermal interfaceHONEYWELL INT INC·Filed 1999·Granted Mar 30, 2004·67 cites·24 claims
- 0870US7064430B2Stacked die packaging and fabrication methodSTATS CHIPPAC LTD·Filed 2004·Granted Jun 20, 2006·16 cites·16 claims
- 0964US6617199B2Electronic device having fibrous interfaceHONEYWELL INT INC·Filed 2001·Granted Sep 9, 2003·11 cites·21 claims
- 1059US7968377B2Integrated circuit protruding pad package systemSTATS CHIPPAC LTD·Filed 2005·Granted Jun 28, 2011·1 cites·4 claims
- 1150US8587098B2Integrated circuit protruding pad package system and method for manufacturing thereofCHOW SENG GUAN·Filed 2011·Granted Nov 19, 2013·0 cites·12 claims
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