Inventor · disambiguated record
Jen-Chieh Lai
Also filed as: LAI JEN CHIEH
13 granted patents·2 pending applications·23 citations·filing 2017–2024
86Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD15
Top patents by PatentIndex Score
15 records- 0193US10170343B1Post-CMP cleaning apparatus and method with brush self-cleaning functionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 1, 2019·14 cites·20 claims
- 0285US10843307B2Vacuum assembly for chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 24, 2020·3 cites·20 claims
- 0383US11251063B2Article transporter in semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·1 cites·20 claims
- 0482US12409529B2Vacuum assembly for chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 9, 2025·1 cites·20 claims
- 0578US12076831B2Chemical mechanical polishing apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 3, 2024·0 cites·20 claims
- 0678US11094554B2Polishing process for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 17, 2021·4 cites·20 claims
- 0777US2024383100A1Vacuum assembly for chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0874US11673223B2Chemical mechanical polishing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 13, 2023·0 cites·20 claims
- 0973US12009222B2Method for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 11, 2024·0 cites·20 claims
- 1068US11239092B2Method for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 1, 2022·0 cites·20 claims
- 1168US2023278160A1Method and system for performing chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1259US10636673B2Method for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 28, 2020·0 cites·20 claims
- 1358US11292101B2Chemical mechanical polishing apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 5, 2022·0 cites·20 claims
- 1456US10804133B2Article transferring method in semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 13, 2020·0 cites·20 claims
- 1555US11685015B2Method and system for performing chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 27, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →