Inventor · disambiguated record
Tai-Yuan Huang
Also filed as: HUANG TAI Y · HUANG TAI-YUAN
11 granted patents·8 pending applications·52 citations·filing 2003–2023
86Inventor score
Files withADVANCED SEMICONDUCTOR ENG11PHISON ELECTRONICS CORP2CHANG HSIAO-CHUAN1HSIUPING INST TECHNOLOGY1HUANG TAI-YUAN1
Top patents by PatentIndex Score
19 records- 0184US11467758B2Data writing method using different programming modes based on the number of available physical erasing units, memory control circuit unit and memory storage devicePHISON ELECTRONICS CORP·Filed 2019·Granted Oct 11, 2022·5 cites·21 claims
- 0278US7466031B2Structure and method of forming metal buffering layerADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Dec 16, 2008·10 cites·13 claims
- 0376US9891048B2Measurement equipmentADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Feb 13, 2018·4 cites·23 claims
- 0476US7253508B2Semiconductor package with a flip chip on a solder-resist leadframeADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Aug 7, 2007·24 cites·14 claims
- 0575US7614888B2Flip chip package processADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Nov 10, 2009·7 cites·12 claims
- 0662US10871914B2Memory management method, memory storage device and memory control circuit unitPHISON ELECTRONICS CORP·Filed 2019·Granted Dec 22, 2020·1 cites·12 claims
- 0755US10222209B2Measurement equipmentADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Mar 5, 2019·0 cites·23 claims
- 0855US8110931B2Wafer and semiconductor packageCHANG HSIAO CHUAN·Filed 2009·Granted Feb 7, 2012·1 cites·21 claims
- 0950US2024151814A1Radar object recognition system and method and non-transitory computer readable mediumNATIONAL YANG MING CHIAO TUNG UNIV·Filed 2023·Application pending·0 cites
- 1050US2024194493A1Substrate and method for manufacturing a substrateADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 1146US2024250030A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 1244US10344383B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jul 9, 2019·0 cites·25 claims
- 1343US2009091036A1Wafer structure with a buffer layerADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
- 1440US2021327731A1Mass transfer method, mass transfer device and buffer carrierADVANCED SEMICONDUCTOR ENG·Filed 2020·Application pending·0 cites
- 1538US2006060765A1Photosensitive bonding package structureHUANG TAI-YUAN·Filed 2005·Application pending·0 cites
- 1638US2006157345A1In-line coating/sputtering system with internal static electricity/dust removal and recycle apparatusesUVAT TECHNOLOGY CO LTD·Filed 2006·Application pending·0 cites
- 1738US2006278523A1Real-time adjustable mechanism of shielding plate in sputtering vacuum chamber designHSIUPING INST TECHNOLOGY·Filed 2005·Application pending·0 cites
- 1836US8059422B2Thermally enhanced package structureTONG HO-MING·Filed 2008·Granted Nov 15, 2011·0 cites·14 claims
- 1935US7071544B2Wafer level assembly packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jul 4, 2006·0 cites·14 claims
Join the waitlist — get patent alerts
Get an alert when Tai-Yuan Huang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →