Inventor · disambiguated record
Jon M. Long
Also filed as: LONG JON · LONG JON M · LONG JON MARK
43 granted patents·2 pending applications·1,765 citations·filing 1987–2024
98Inventor score
Top patents by PatentIndex Score
45 records- 0196US11327259B2Integrated circuit package with electro-optical interconnect circuitryINTEL CORP·Filed 2017·Granted May 10, 2022·17 cites·20 claims
- 0296US7405477B1Ball grid array package-to-board interconnect co-design apparatusALTERA CORP·Filed 2005·Granted Jul 29, 2008·100 cites·22 claims
- 0395US5173766ASemiconductor device package and method of making such a packageLSI LOGIC CORP·Filed 1990·Granted Dec 22, 1992·342 cites·5 claims
- 0494US9002155B2Integrated optical-electronic interface in programmable integrated circuit deviceLI PENG·Filed 2012·Granted Apr 7, 2015·23 cites·15 claims
- 0593US5087961ASemiconductor device packageLSI LOGIC CORP·Filed 1990·Granted Feb 11, 1992·228 cites·1 claims
- 0692US7514789B1Ball grid array package-to-board interconnect co-design apparatusALTERA CORP·Filed 2008·Granted Apr 7, 2009·30 cites·8 claims
- 0791US5831836APower plane for semiconductor deviceLSI LOGIC·Filed 1992·Granted Nov 3, 1998·150 cites·11 claims
- 0890US6864565B1Post-passivation thick metal pre-routing for flip chip packagingALTERA CORP·Filed 2002·Granted Mar 8, 2005·65 cites·23 claims
- 0990US5260234AMethod for bonding a lead to a die pad using an electroless plating solutionVLSI TECHNOLOGY INC·Filed 1991·Granted Nov 9, 1993·122 cites·6 claims
- 1090US5023202ARigid strip carrier for integrated circuitsLSI LOGIC CORP·Filed 1989·Granted Jun 11, 1991·87 cites·28 claims
- 1188US6407450B1Semiconductor package with universal substrate for electrically interfacing with different sized chips that have different logic functionsALTERA CORP·Filed 2000·Granted Jun 18, 2002·54 cites·21 claims
- 1287US6303469B1Thin microelectronic substrates and methods of manufactureMICRON TECHNOLOGY INC·Filed 2000·Granted Oct 16, 2001·63 cites·32 claims
- 1386US9608728B1Integrated circuit device with field programmable optical arrayALTERA CORP·Filed 2014·Granted Mar 28, 2017·7 cites·25 claims
- 1483US9040348B2Electronic assembly apparatus and associated methodsVODRAHALLI NAGESH·Filed 2012·Granted May 26, 2015·9 cites·23 claims
- 1583US4771330AWire bonds and electrical contacts of an integrated circuit deviceLSI LOGIC CORP·Filed 1987·Granted Sep 13, 1988·61 cites·5 claims
- 1681US10075189B2Techniques for variable forward error correctionALTERA CORP·Filed 2015·Granted Sep 11, 2018·5 cites·20 claims
- 1780US5349495ASystem for securing and electrically connecting a semiconductor chip to a substrateVLSI TECHNOLOGY INC·Filed 1990·Granted Sep 20, 1994·67 cites·19 claims
- 1879US8716876B1Systems and methods for stacking a memory chip above an integrated circuit chipSMOLEN RICHARD G·Filed 2011·Granted May 6, 2014·7 cites·31 claims
- 1978US2024418951A1Integrated circuit package with electro-optical interconnect circuitryINTEL CORP·Filed 2024·Application pending·0 cites
- 2075US5175612AHeat sink for semiconductor device assemblyLSI LOGIC CORP·Filed 1992·Granted Dec 29, 1992·48 cites·15 claims
- 2174US12055777B2Integrated circuit package with electro-optical interconnect circuitryINTEL CORP·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
- 2274US5210440ASemiconductor chip cooling apparatusVLSI TECHNOLOGY INC·Filed 1991·Granted May 11, 1993·50 cites·16 claims
- 2371US5206794AIntegrated circuit package with device and wire coat assemblyVLSI TECHNOLOGY INC·Filed 1991·Granted Apr 27, 1993·44 cites·18 claims
- 2468US4800419ASupport assembly for integrated circuitsLSI LOGIC CORP·Filed 1987·Granted Jan 24, 1989·41 cites·4 claims
- 2564US5233131AIntegrated circuit die-to-leadframe interconnect assembly systemVLSI TECHNOLOGY INC·Filed 1991·Granted Aug 3, 1993·35 cites·23 claims
- 2663US9110128B1IC package for pin counts less than test requirementsLONG JON M·Filed 2008·Granted Aug 18, 2015·3 cites·21 claims
- 2761US7091613B1Elongated bonding pad for wire bonding and sort probingALTERA CORP·Filed 2003·Granted Aug 15, 2006·11 cites·10 claims
- 2859US5166607AMethod and apparatus to heat the surface of a semiconductor die in a device during burn-in while withdrawing heat from device leadsVLSI TECHNOLOGY INC·Filed 1991·Granted Nov 24, 1992·19 cites·21 claims
- 2957US6693342B2Thin microelectronic substrates and methods of manufactureMICRON TECHNOLOGY INC·Filed 2001·Granted Feb 17, 2004·8 cites·25 claims
- 3052US10212498B1Integrated circuit device with field programmable optical arrayALTERA CORP·Filed 2017·Granted Feb 19, 2019·0 cites·20 claims
- 3151US5218215ASemiconductor device package having a thermal dissipation means that allows for lateral movement of the lead frame with respect to the housing without breakage of the thermal dissipation pathVLSI TECHNOLOGY INC·Filed 1990·Granted Jun 8, 1993·19 cites·13 claims
- 3247US8076761B1Reduced inductance IC leaded packageLONG JON M·Filed 2004·Granted Dec 13, 2011·3 cites·13 claims
- 3346US12475136B1Transforming data using database, object oriented programming, and stored program conceptsTRULIOO INFORMATION SERVICES INC·Filed 2024·Granted Nov 18, 2025·0 cites·20 claims
- 3444US9698123B2Apparatus for stacked electronic circuitry and associated methodsRAHMAN ARIFUR·Filed 2011·Granted Jul 4, 2017·0 cites·14 claims
- 3544US4790897ADevice for bonding of lead wires for an integrated circuit deviceLSI LOGIC CORP·Filed 1987·Granted Dec 13, 1988·12 cites·5 claims
- 3641US5407275ANon-destructive test for inner lead bond of a tab deviceVLSI TECHNOLOGY INC·Filed 1992·Granted Apr 18, 1995·8 cites·10 claims
- 3739US5304738ASystem for protecting leads of a semiconductor chip package during testing, burn-in and handlingVLSI TECHNOLOGY INC·Filed 1993·Granted Apr 19, 1994·8 cites·8 claims
- 3837US6914317B2Thin microelectronic substrates and methods of manufactureMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 5, 2005·0 cites·13 claims
- 3935US5221812ASystem for protecting leads to a semiconductor chip package during testing, burn-in and handlingVLSI TECHNOLOGY INC·Filed 1991·Granted Jun 22, 1993·6 cites·15 claims
- 4035US5210375AElectronic device package--carrier assembly ready to be mounted onto a substrateVLSI TECHNOLOGY INC·Filed 1991·Granted May 11, 1993·6 cites·8 claims
- 4135US2002145207A1Method and structure for integrated circuit packageFiled 2000·Application pending·0 cites
- 4233US5307559AMethod of providing a capacitor within a semiconductor device packageLSI LOGIC CORP·Filed 1992·Granted May 3, 1994·4 cites·18 claims
- 4331US5200642AInternal capacitor arrangement for semiconductor device assemblyLSI LOGIC CORP·Filed 1989·Granted Apr 6, 1993·2 cites·9 claims
- 4430US5408741AMethod for forming electronic deviceVLSI TECHNOLOGY INC·Filed 1992·Granted Apr 25, 1995·0 cites·11 claims
- 4515US4766842AMethod and means for wave soldering of leads of an integrated circuit packageLONG JON·Filed 1987·Granted Aug 30, 1988·1 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →