Inventor · disambiguated record
Liang-Yueh Ou Yang
Also filed as: OU YANG LIANG-YUEH
10 granted patents·1 pending application·37 citations·filing 2015–2024
87Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD11
Top patents by PatentIndex Score
11 records- 0195US10985061B2Methods for forming contact plugs with reduced corrosionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 20, 2021·8 cites·20 claims
- 0295US10483165B2Methods for forming contact plugs with reduced corrosionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 19, 2019·8 cites·20 claims
- 0394US10186456B2Methods for forming contact plugs with reduced corrosionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 22, 2019·8 cites·20 claims
- 0485US10636702B2Conductive interconnect structures in integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 28, 2020·4 cites·20 claims
- 0585US2024363409A1Methods for forming contact plugs with reduced corrosionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0684US10157785B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·3 cites·20 claims
- 0782US10867845B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·2 cites·14 claims
- 0878US10879114B1Conductive fillTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·2 cites·20 claims
- 0975US9786604B2Metal cap apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 10, 2017·2 cites·19 claims
- 1063US10872815B2Conductive interconnect structures in integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 22, 2020·0 cites·20 claims
- 1160US10497615B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 3, 2019·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →