Inventor · disambiguated record
Hsien-Cheng Wang
Also filed as: WANG HSIEN-CHENG
41 granted patents·3 pending applications·117 citations·filing 2006–2022
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD26TAIWAN SEMICONDUCTOR MFG10WANG HSIEN-CHENG4WEN MING-CHANG1YAO HSIN-CHIEH1
Top patents by PatentIndex Score
44 records- 0197US8507177B2Photoresist materials and photolithography processesWANG HSIEN-CHENG·Filed 2011·Granted Aug 13, 2013·34 cites·19 claims
- 0295US11244832B2Semiconductor structure with mask structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 8, 2022·3 cites·20 claims
- 0391US9779984B1Method of forming trenches with different depthsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 3, 2017·5 cites·20 claims
- 0491US9437495B2Mask-less dual silicide processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 6, 2016·13 cites·20 claims
- 0587US9331173B2Semiconductor device having a carbon containing insulation layer formed under the source/drainTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted May 3, 2016·5 cites·20 claims
- 0687US8098364B2Exposure apparatus and method for photolithography processYU VINVENT·Filed 2007·Granted Jan 17, 2012·18 cites·13 claims
- 0784US10861740B2Method of forming trenches with different depthsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 8, 2020·2 cites·20 claims
- 0883US9449886B2Semiconductor device and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 20, 2016·4 cites·20 claims
- 0982US8513821B2Overlay mark assistant featureYAO HSIN-CHIEH·Filed 2010·Granted Aug 20, 2013·7 cites·20 claims
- 1081US9425048B2Mechanisms for semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 23, 2016·3 cites·16 claims
- 1181US9318488B2Semiconductor device and formation thereofTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 19, 2016·5 cites·20 claims
- 1279US9123563B2Method of forming contact structure of gate structureTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 1, 2015·3 cites·20 claims
- 1378US9000525B2Structure and method for alignment marksWEN MING-CHANG·Filed 2010·Granted Apr 7, 2015·5 cites·20 claims
- 1477US10163703B2Method for forming self-aligned contactTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·2 cites·20 claims
- 1574US11682579B2Method of forming trenches with different depthsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 20, 2023·0 cites·20 claims
- 1672US10163738B2Structure and method for overlay marksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·1 cites·20 claims
- 1770US9299657B2Semiconductor device and method for manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 29, 2016·2 cites·20 claims
- 1868US11121128B2Structure and method for alignment marksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 14, 2021·0 cites·20 claims
- 1968US10790197B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 29, 2020·0 cites·20 claims
- 2067US8416393B2Cross quadrupole double lithography method and apparatus for semiconductor device fabrication using two aperturesWANG HSIEN-CHENG·Filed 2009·Granted Apr 9, 2013·2 cites·19 claims
- 2165US10727068B2Method for manufacturing semiconductor structure with mask structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 28, 2020·0 cites·20 claims
- 2265US10510614B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 17, 2019·0 cites·20 claims
- 2365US9543406B2Structure and method for overlay marksWANG HSIEN-CHENG·Filed 2011·Granted Jan 10, 2017·1 cites·20 claims
- 2464US10276448B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 30, 2019·0 cites·20 claims
- 2563US11348830B2Method of forming trenches with different depthsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 31, 2022·0 cites·20 claims
- 2662US9093299B1Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 28, 2015·1 cites·20 claims
- 2760US10283403B2Method of forming trenches with different depthsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 7, 2019·0 cites·20 claims
- 2860US10109530B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 23, 2018·0 cites·20 claims
- 2959US9754838B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 5, 2017·0 cites·20 claims
- 3059US9214347B2Overlay mark assistant featureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 15, 2015·1 cites·20 claims
- 3157US10468257B2Mechanisms for semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 5, 2019·0 cites·20 claims
- 3256US10276437B2Contact structure of gate structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 30, 2019·0 cites·20 claims
- 3356US9508844B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 29, 2016·0 cites·20 claims
- 3456US8848163B2Photoresist materials and photolithography processesWANG HSIEN-CHENG·Filed 2011·Granted Sep 30, 2014·0 cites·16 claims
- 3555US9679812B2Semiconductor device with self-aligned contactTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 13, 2017·0 cites·20 claims
- 3654US9536754B2Method of forming contact structure of gate structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 3, 2017·0 cites·20 claims
- 3753US10665585B2Structure and method for alignment marksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 26, 2020·0 cites·20 claims
- 3853US7972761B2Photoresist materials and photolithography processTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Jul 5, 2011·0 cites·18 claims
- 3952US9312259B2Integrated circuit structure with thinned contactTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 12, 2016·0 cites·20 claims
- 4052US2012082940A1Photolithography process for semiconductor deviceYU VINCENT·Filed 2011·Application pending·0 cites
- 4151US9280041B2Cross quadrupole double lithography method using two complementary aperturesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 8, 2016·0 cites·14 claims
- 4249US9576847B2Method for forming integrated circuit structure with thinned contactTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 21, 2017·0 cites·20 claims
- 4345US2008156346A1Method and apparatus for cleaning a substrateTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 4440US2011212403A1Method and apparatus for enhanced dipole lithographyTAIWAN SEMICONDUCTOR MFG·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →