Inventor · disambiguated record
Tung Lok Li
Also filed as: LI TUNG L · LI TUNG LOK
12 granted patents·2 pending applications·182 citations·filing 1993–2013
90Inventor score
Technology areasH10W
Top patents by PatentIndex Score
14 records- 0196US8072053B2Leadless integrated circuit package having electrically routed contactsLI TUNG LOK·Filed 2009·Granted Dec 6, 2011·121 cites·21 claims
- 0274US9337095B2Method of manufacturing leadless integrated circuit packages having electrically routed contactsKAIXIN INC·Filed 2013·Granted May 10, 2016·4 cites·20 claims
- 0374US8497159B2Method of manufacturing leadless integrated circuit packages having electrically routed contactsLI TUNG LOK·Filed 2011·Granted Jul 30, 2013·3 cites·9 claims
- 0473US7875970B2Integrated circuit package having a castellated heatspreaderGREEN ARROW ASIA LTD·Filed 2009·Granted Jan 25, 2011·7 cites·18 claims
- 0564US9806006B2Etch isolation LPCC/QFN stripLI TUNG LOK·Filed 2007·Granted Oct 31, 2017·3 cites·20 claims
- 0662US7973394B2Enhanced integrated circuit packageBLONDWICH LTD·Filed 2009·Granted Jul 5, 2011·3 cites·10 claims
- 0759US8513786B2Pre-bonded substrate for integrated circuit package and method of making the sameMCMILLAN JOHN ROBERT·Filed 2011·Granted Aug 20, 2013·1 cites·23 claims
- 0857US8338924B2Substrate for integrated circuit package with selective exposure of bonding compound and method of making thereofMCMILLAN JOHN ROBERT·Filed 2011·Granted Dec 25, 2012·1 cites·24 claims
- 0955US5531860AStructure and method for providing a lead frame with enhanced solder wetting leadsQPL LIMITED·Filed 1995·Granted Jul 2, 1996·21 cites·6 claims
- 1048US8124462B2Enhanced integrated circuit packageLI TUNG LOK·Filed 2011·Granted Feb 28, 2012·0 cites·9 claims
- 1146US5444293AStructure and method for providing a lead frame with enhanced solder wetting leadsOPL LIMITED·Filed 1993·Granted Aug 22, 1995·18 cites·3 claims
- 1244US8569110B2Pre-bonded substrate for integrated circuit package and method of making the sameMCMILLAN JOHN ROBERT·Filed 2011·Granted Oct 29, 2013·0 cites·32 claims
- 1340US2011092027A1Integrated circuit package having a castellated heatspreaderGREEN ARROW ASIA LTD·Filed 2010·Application pending·0 cites
- 1435US2010314728A1Ic package having an inductor etched into a leadframe thereofLI TUNG LOK·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Tung Lok Li files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →