Inventor · disambiguated record
Cheong Kow
Also filed as: KOW CHEONG · KOW CHEONG H
4 granted patents·3 pending applications·136 citations·filing 2000–2006
76Inventor score
Files withSIKA CORP2KCH HI TECH SDN BHD MALAYSIAN1MYERS ROBERT D1ROSENBERG STEVEN A1SIKA TECHNOLOGY AG1
Top patents by PatentIndex Score
7 records- 0196US6319964B1Acoustic baffle with predetermined directional expansion characteristicsSIKA CORP·Filed 2000·Granted Nov 20, 2001·121 cites·41 claims
- 0266US7186442B2Constrained layer damperSIKA TECHNOLOGY AG·Filed 2003·Granted Mar 6, 2007·11 cites·39 claims
- 0361US6562878B2Acoustic baffle with predetermined directional expansion characteristicsSIKA CORP·Filed 2001·Granted May 13, 2003·4 cites·36 claims
- 0449US2007034432A1Solid thermally expansible materialROSENBERG STEVEN A·Filed 2006·Application pending·0 cites
- 0545US2005185787A1Method and apparatus for facilitating access to telephone communicationsKCH HI TECH SDN BHD MALAYSIAN·Filed 2004·Application pending·0 cites
- 0640US8647454B2Method for manufacturing physical barriersMYERS ROBERT D·Filed 2005·Granted Feb 11, 2014·0 cites·13 claims
- 0739US2004011282A1System and method for manufacturing physical barriersFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →