Inventor · disambiguated record
Tatsuya Kanamaru
Also filed as: KANAMARU TATSUYA
13 granted patents·3 pending applications·207 citations·filing 1979–2016
92Inventor score
Top patents by PatentIndex Score
16 records- 0185US5525431AZinc-base galvanized sheet steel excellent in press-formability, phosphatability, etc. and process for producing the sameNIPPON STEEL CORP·Filed 1993·Granted Jun 11, 1996·51 cites·16 claims
- 0283US4510209ATwo layer-coated steel materials and process for producing the sameNIPPON STEEL CORP·Filed 1981·Granted Apr 9, 1985·43 cites·6 claims
- 0374US4877494ACorrosion resistant plated steel strip and method for producing sameNIPPON STEEL CORP·Filed 1989·Granted Oct 31, 1989·18 cites·13 claims
- 0464US4897317ACorrosion resistant Zn-Cr plated steel stripNIPPON STEEL CORP·Filed 1988·Granted Jan 30, 1990·12 cites·8 claims
- 0562US5049453AGalvannealed steel sheet with distinguished anti-powdering and anti-flaking properties and process for producing the sameNIPPON STEEL CORP·Filed 1990·Granted Sep 17, 1991·36 cites·78 claims
- 0662US4256519AMethod for heat treatment of low melting point-metal plated steel bandNIPPON STEEL CORP·Filed 1979·Granted Mar 17, 1981·10 cites·12 claims
- 0759US6709753B2Silicone-modified epoxy or phenolic resin compositions and semiconductor devices sealed therewithSHINETSU CHEMICAL CO·Filed 2002·Granted Mar 23, 2004·9 cites·15 claims
- 0858US4578158AProcess for electroplating a metallic material with an iron-zinc alloyNIPPON STEEL CORP·Filed 1984·Granted Mar 25, 1986·10 cites·2 claims
- 0957US8110066B2Adhesive composition suitable to be applied by screen printingKANAMARU TATSUYA·Filed 2008·Granted Feb 7, 2012·2 cites·12 claims
- 1056US8815400B2Epoxy resin composition, die attach method using same, and semiconductor device containing cured product thereofKANAMARU TATSUYA·Filed 2012·Granted Aug 26, 2014·1 cites·13 claims
- 1154US6733902B2Liquid epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2002·Granted May 11, 2004·6 cites·11 claims
- 1253US6627328B2Light-transmissive epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2001·Granted Sep 30, 2003·5 cites·15 claims
- 1351US6794058B2Flip-chip type semiconductor deviceSHINETSU CHEMICAL CO·Filed 2003·Granted Sep 21, 2004·4 cites·2 claims
- 1449US2013175485A1Electroconductive liquid resin composition and an electronic partSHINETSU CHEMICAL CO·Filed 2012·Application pending·0 cites
- 1542US2002058742A1Light-transmissive epoxy resin composition and flip-chip type semiconductor deviceFiled 2001·Application pending·0 cites
- 1636US2017158926A1Liquid resin composition, die attaching method using same and semiconductor device having cured product of sameSHINETSU CHEMICAL CO·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →