Inventor · disambiguated record
Yung Ho Ryu
Also filed as: RYU YUNG H · RYU YUNG HO
13 granted patents·6 pending applications·47 citations·filing 2001–2015
88Inventor score
Top patents by PatentIndex Score
19 records- 0193US9450151B2Semiconductor light-emitting deviceSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Sep 20, 2016·12 cites·20 claims
- 0277US7473571B2Method for manufacturing vertically structured light emitting diodeSAMSUNG ELECTRO MECH·Filed 2006·Granted Jan 6, 2009·12 cites·25 claims
- 0371US7078256B2Nitride semiconductor LED improved in lighting efficiency and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2004·Granted Jul 18, 2006·12 cites·12 claims
- 0468US8581293B2Semiconductor light emitting deviceRYU YUNG HO·Filed 2011·Granted Nov 12, 2013·2 cites·18 claims
- 0567US9087932B2Semiconductor light emitting device and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jul 21, 2015·1 cites·8 claims
- 0667US7442565B2Method for manufacturing vertical structure light emitting diodeSAMSUNG ELECTRO MECH·Filed 2006·Granted Oct 28, 2008·4 cites·15 claims
- 0766US8334156B2Nitride semiconductor single crystal substrate, and methods of fabricating the same and a vertical nitride semiconductor light emitting diode using the sameKIM CHEOL KYU·Filed 2009·Granted Dec 18, 2012·2 cites·20 claims
- 0860US9676047B2Method of forming metal bonding layer and method of manufacturing semiconductor light emitting device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 13, 2017·1 cites·16 claims
- 0958US8928027B2Semiconductor light emitting deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 6, 2015·0 cites·10 claims
- 1054US7859086B2Nitride semiconductor single crystal substrate, and methods of fabricating the same and a vertical nitride semiconductor light emitting diode using the sameSAMSUNG LED CO LTD·Filed 2007·Granted Dec 28, 2010·0 cites·7 claims
- 1150US8828761B2Manufacturing a semiconductor light emitting device using a trench and support substrateSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 9, 2014·0 cites·20 claims
- 1247US2014273318A1Method of forming metallic bonding layer and method of manufacturing semiconductor light emitting device therewithSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 1344US2006208264A1Nitride semiconductor LED improved in lighting efficiency and fabrication method thereofRYU YUNG H·Filed 2006·Application pending·0 cites
- 1441US2007090382A1Light emitting diode packageSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 1540US8829548B2Light emitting device package and fabrication method thereofYANG JONG IN·Filed 2012·Granted Sep 9, 2014·0 cites·14 claims
- 1640US2006234411A1Method of manufacturing nitride semiconductor light emitting diodeSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 1738US6533892B2Device for etching the backside of waferSAMSUNG ELECTRO MECH·Filed 2001·Granted Mar 18, 2003·1 cites·7 claims
- 1836US2012181570A1Semiconductor light emitting device and fabrication method thereofKO HYUNG DUK·Filed 2012·Application pending·0 cites
- 1935US2005179045A1Nitride semiconductor light emitting diode having improved ohmic contact structure and fabrication method thereofFiled 2004·Application pending·0 cites
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