Inventor · disambiguated record
Tsing-Fong Hwang
Also filed as: HWANG TSING-FONG
6 granted patents·90 citations·filing 1999–2003
84Inventor score
Top patents by PatentIndex Score
6 records- 0168US6077767AModified implementation of air-gap low-K dielectric for unlanded viaUNITED SEMICONDUCTOR CORP·Filed 1999·Granted Jun 20, 2000·39 cites·14 claims
- 0264US6380073B1Method for forming metal interconnection structure without corner facetedUNITED MICROELECTRONICS CORP·Filed 2000·Granted Apr 30, 2002·14 cites·23 claims
- 0363US6914318B2Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the sameUNITED MICROELECTRONICS CORP·Filed 2003·Granted Jul 5, 2005·10 cites·35 claims
- 0459US6888247B2Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the sameUNITED MICROELECTRONICS CORP·Filed 2001·Granted May 3, 2005·8 cites·12 claims
- 0552US6211048B1Method of reducing salicide lateral growthUNITED MICROELECTRONICS CORP·Filed 1999·Granted Apr 3, 2001·14 cites·20 claims
- 0651US6940146B2Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the sameUNITED MICROELECTRONICS CORP·Filed 2003·Granted Sep 6, 2005·5 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →