Inventor · disambiguated record
Kurt Lehman
Also filed as: LEHMAN KURT · LEHMAN KURT R
21 granted patents·1 pending application·723 citations·filing 1993–2019
96Inventor score
Top patents by PatentIndex Score
22 records- 0199US6433541B1In-situ metalization monitoring using eddy current measurements during the process for removing the filmKLA TENCOR CORP·Filed 2000·Granted Aug 13, 2002·161 cites·21 claims
- 0298US8010222B2Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or toolKLA TENCOR TECH CORP·Filed 2008·Granted Aug 30, 2011·29 cites·10 claims
- 0398US6707540B1In-situ metalization monitoring using eddy current and optical measurementsKLA TENCOR CORP·Filed 2000·Granted Mar 16, 2004·162 cites·38 claims
- 0496US6621264B1In-situ metalization monitoring using eddy current measurements during the process for removing the filmKLA TENCOR CORP·Filed 2002·Granted Sep 16, 2003·72 cites·15 claims
- 0593US7070476B2In-situ metalization monitoring using eddy current measurements during the process for removing the filmKLA TENCOR CORP·Filed 2005·Granted Jul 4, 2006·17 cites·3 claims
- 0693US6866559B2Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing padKLA TENCOR TECHNOLOGIES·Filed 2003·Granted Mar 15, 2005·31 cites·90 claims
- 0792US8754972B2Integrated multi-channel analog front end and digitizer for high speed imaging applicationsBROWN DAVID L·Filed 2012·Granted Jun 17, 2014·20 cites·39 claims
- 0892US7332438B2Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or toolKLA TENCOR TECH CORP·Filed 2006·Granted Feb 19, 2008·11 cites·9 claims
- 0992US6884146B2Systems and methods for characterizing a polishing processKLA TENCOR TECH CORP·Filed 2003·Granted Apr 26, 2005·24 cites·39 claims
- 1086US6935922B2Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishingKLA TENCOR TECH CORP·Filed 2003·Granted Aug 30, 2005·16 cites·100 claims
- 1186US6628397B1Apparatus and methods for performing self-clearing optical measurementsKLA TENCOR·Filed 1999·Granted Sep 30, 2003·68 cites·27 claims
- 1284US8831767B2Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or toolLEHMAN KURT·Filed 2011·Granted Sep 9, 2014·3 cites·19 claims
- 1384US7030018B2Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or toolKLA TENCOR TECH CORP·Filed 2003·Granted Apr 18, 2006·14 cites·23 claims
- 1480US7175503B2Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current deviceKLA TENCOR TECH CORP·Filed 2003·Granted Feb 13, 2007·11 cites·47 claims
- 1579US7052369B2Methods and systems for detecting a presence of blobs on a specimen during a polishing processKLA TENCOR TECH CORP·Filed 2003·Granted May 30, 2006·10 cites·38 claims
- 1679US6885190B2In-situ metalization monitoring using eddy current measurements during the process for removing the filmKLA TENCOR CORP·Filed 2003·Granted Apr 26, 2005·11 cites·2 claims
- 1774US9462206B2Integrated multi-channel analog front end and digitizer for high speed imaging applicationsKLA TENCOR CORP·Filed 2014·Granted Oct 4, 2016·2 cites·20 claims
- 1874US5552704AEddy current test method and apparatus for measuring conductance by determining intersection of lift-off and selected curvesTENCOR INSTRUMENTS·Filed 1993·Granted Sep 3, 1996·56 cites·30 claims
- 1966US10905613B2Transfer boardLEHMAN KURT·Filed 2018·Granted Feb 2, 2021·2 cites·4 claims
- 2052US7096752B1Environmental damage reductionKLA TENCOR TECH CORP·Filed 2004·Granted Aug 29, 2006·3 cites·12 claims
- 2151US2006148383A1Methods and systems for detecting a presence of blobs on a specimen during a polishing processKLA TENCOR TECHNOLOGIES·Filed 2006·Application pending·0 cites
- 2247US10724964B1Multi-sensor tiled camera with flexible electronics for wafer inspectionKLA TENCOR CORP·Filed 2019·Granted Jul 28, 2020·0 cites·13 claims
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