Inventor · disambiguated record
Galen P. Cook
Also filed as: COOK GALEN · COOK GALEN P
16 granted patents·1 pending application·22 citations·filing 2007–2023
89Inventor score
Top patents by PatentIndex Score
17 records- 0196US11712896B2Nozzle arrangements and supply channelsHEWLETT PACKARD DEVELOPMENT CO·Filed 2022·Granted Aug 1, 2023·2 cites·15 claims
- 0293US11305537B2Nozzle arrangements and supply channelsHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Apr 19, 2022·4 cites·15 claims
- 0392US11034151B2Nozzle arrangementsHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Jun 15, 2021·3 cites·20 claims
- 0490US11345162B2Fluid recirculation channelsHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted May 31, 2022·4 cites·13 claims
- 0584US11807005B2Nozzle arrangementsHEWLETT PACKARD DEVELOPMENT CO·Filed 2023·Granted Nov 7, 2023·0 cites·20 claims
- 0678US8690295B2Fluid nozzle arrayBENGALI SADIQ·Filed 2010·Granted Apr 8, 2014·3 cites·15 claims
- 0777US11958293B2Nozzle arrangementsHEWLETT PACKARD DEVELOPMENT CO·Filed 2021·Granted Apr 16, 2024·0 cites·20 claims
- 0874US9033482B2Fluid dispenserAGARWAL ARUN·Filed 2012·Granted May 19, 2015·2 cites·23 claims
- 0968US9815282B2Fluid ejection structureHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2014·Granted Nov 14, 2017·1 cites·16 claims
- 1065US8708461B2Thermal resistor fluid ejection assemblyCHUNG BRADLEY D·Filed 2010·Granted Apr 29, 2014·1 cites·20 claims
- 1164US9033470B2Fluid ejection assembly and related methodsBENGALI SADIQ·Filed 2011·Granted May 19, 2015·1 cites·16 claims
- 1258US9511587B2ResistorCOOK GALEN P·Filed 2011·Granted Dec 6, 2016·1 cites·20 claims
- 1353US11685115B2Additive manufacturing with nozzles at different die widthsHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Jun 27, 2023·0 cites·17 claims
- 1452US11247470B2Nozzle arrangements and feed holesHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Feb 15, 2022·0 cites·20 claims
- 1549US9289987B2Heating element for a printheadHEWLETT PACKARD DEVELOPMENT CO·Filed 2012·Granted Mar 22, 2016·0 cites·15 claims
- 1638US2010231655A1Inkjet-printing device printhead die having edge protection layer for heating resistorHEWLETT PACKARD DEVELOPEMENT C·Filed 2007·Application pending·0 cites
- 1735US8877646B2Film stacks and methods thereofMARTY VALERIE J·Filed 2010·Granted Nov 4, 2014·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →