Inventor · disambiguated record
Jeff Blackwood
Also filed as: BLACKWOOD JEFF · BLACKWOOD JEFF E
11 granted patents·145 citations·filing 2001–2017
91Inventor score
Top patents by PatentIndex Score
11 records- 0196US8134124B2Method for creating S/tem sample and sample structureBLACKWOOD JEFF·Filed 2007·Granted Mar 13, 2012·42 cites·25 claims
- 0295US8536525B2Method for creating S/TEM sample and sample structureBLACKWOOD JEFF·Filed 2012·Granted Sep 17, 2013·16 cites·14 claims
- 0393US8859963B2Methods for preparing thin samples for TEM imagingMORIARTY MICHAEL·Filed 2012·Granted Oct 14, 2014·16 cites·17 claims
- 0492US8525137B2Method for creating S/TEM sample and sample structureBLACKWOOD JEFF·Filed 2007·Granted Sep 3, 2013·13 cites·26 claims
- 0590US7675049B2Sputtering coating of protective layer for charged particle beam processingFEI CO·Filed 2007·Granted Mar 9, 2010·15 cites·19 claims
- 0684US9653260B2High throughput TEM preparation processes and hardware for backside thinning of cross-sectional view lamellaFEI CO·Filed 2012·Granted May 16, 2017·7 cites·26 claims
- 0783US6747464B1Wafer holder for backside viewing, frontside probing on automated wafer probe stationsLSI LOGIC CORP·Filed 2001·Granted Jun 8, 2004·29 cites·17 claims
- 0863US8097308B2Protective layer for charged particle beam processingBLACKWOOD JEFF·Filed 2007·Granted Jan 17, 2012·1 cites·24 claims
- 0953US10283317B2High throughput TEM preparation processes and hardware for backside thinning of cross-sectional view lamellaFEI CO·Filed 2017·Granted May 7, 2019·0 cites·25 claims
- 1053US6847123B2Vertically staggered bondpad arrayLSI LOGIC CORP·Filed 2002·Granted Jan 25, 2005·6 cites·6 claims
- 1149US9263306B2Protective layer for charged particle beam processingBLACKWOOD JEFF·Filed 2012·Granted Feb 16, 2016·0 cites·9 claims
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